China Factory High and Low Temperature Thermal Shock Test Chamber

Product Details
Customization: Available
Usage: SMT Production Line, Printing Workshop, Computer Room, Electronic Component Maintenance Room, Combustible & Explosive Area, Lab Equipment
Condition: New
Gold Member Since 2018

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Plant Area
>2000 square meters
Management System Certification
ISO 9001
  • China Factory High and Low Temperature Thermal Shock Test Chamber
  • China Factory High and Low Temperature Thermal Shock Test Chamber
  • China Factory High and Low Temperature Thermal Shock Test Chamber
  • China Factory High and Low Temperature Thermal Shock Test Chamber
  • China Factory High and Low Temperature Thermal Shock Test Chamber
  • China Factory High and Low Temperature Thermal Shock Test Chamber
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Basic Info.

Model NO.
TS-80
Material
Metal
Type
Test Chamber
Transport Package
Customized
Specification
Customized
Trademark
ECW
Origin
China
HS Code
8514109000
Production Capacity
100000PC

Product Description

Product Overview  
This series of programmable high and low temperature thermal shock test chambers is mainly used to test the resistance of materials to extremely high or low temperature, which is similar to the situation of discontinuously being in high or low temperature. Complete the test in the shortest possible time. Changes or physical damage during thermal shocks are caused by changes in thermal expansion and contraction or changes in other physical values. Only by this test can various products be completely trusted. The effects of thermal shock include electrochemical changes caused by cracking or layer breaking and displacement of the finished product. The full digital automatic control of the PID system will make your operation easy.
Applicable industry
High and low temperature thermal shock test chamber is widely used in electronic and electrical components, automation components, communication components, auto parts, metals, chemical materials, plastics and other industries, defense industry, aerospace, ordnance industry, BGA, PCB base plate. Changes in the physical properties of electronic chip ICs, semiconductor ceramics and polymer materials, testing the repeated resistance of materials to high and low temperatures. The force and the chemical change or physical damage of the product in thermal expansion and contraction can confirm the quality of the product, from precision IC to heavy machinery. The components can be used as the basis or reference for product improvement.

Standards compliant
GJB360.7-87 temperature shock test;
GJB367.2-87 405 temperature shock test;
SJ/T10187-91Y73 series temperature change test box--one box type;
SJ/T10186-91Y73 series temperature change test box--two box type;
Meet the standard IEC68-2-14_test method N_temperature change;
GB/T 2424.13-2002 test method temperature change test guide;
GB/T 2423.22-2002 temperature change;

Features:
1, servo refrigerant flow control technology can effectively save energy by more than 40%.
2, the number of cycles and automatic defrosting can be set, effectively reaching once every 3 days, and it only takes 2 hours to defrost.
3, pure aluminum finned evaporator, effectively reducing energy storage time and saving energy.
4, with two-box and three-box test functions, in line with test specifications.
5, real-time experimental curve analysis, equipped with RS232 data storage connection.
6, there is an alarm prompt to solve the alarm device screen graphic explanation.
7, at the end of the test, the product under test will automatically return to normal temperature to avoid frost and condensation protection mechanism, abnormal or fault display and troubleshooting instructions; Pneumatic valves are easy to open to ensure airtight and thermal insulation protection.
Model No. TS-50 TS-80 TS-150 TS-225 TS-408
Inner chamber size 36*35*40cm 50*40*40cm 60*50*50cm 50*75*60cm 60*85*80cm
Outer chamber size 138*180*155cm 150*190*160cm 190*200*1950cm 210*220*205cm 225*250*220cm
Thermal shock range -40-150ºC
Thermal shock time Within 5min
Precooling zone -60ºC adjustable
Preheating zone 170ºC adjustable
Temp stability ±0.5ºC
Temp ±1ºC
Cooling rate 1ºC/min( no load nonlinear  )
Heating rate 2-3ºC/min(no load nonlinear )
Input voltage 380V/13kw
Test zone Placing test objects
Preheating zone The high temperature zone is responsible for heat storage
Precooling zone The low temperature zone is responsible for cold storage
China Factory High and Low Temperature Thermal Shock Test ChamberChina Factory High and Low Temperature Thermal Shock Test Chamber

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